Thermal mismatch induced by the die bonding structure greatly affects the reliability and performance of MEMS devices.

芯片粘接工艺引起的器件-封装热失配会对MEMS器件的可靠性和性能产生显著影响。

The die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.

半导体封装粘结工艺养护过程要求炉内温度均匀分布，现有养护炉不能满足这一要求。

The thermal resister of power LED is analyzed in this paper. Using the silver paste and epoxy resin as die bonding materials, two kinds of power LEDs are made.

分析了功率型LED热阻系统的构成，对采用银浆和环氧胶作为芯片键合材料的功率型LED热阻进行了对比研究。

It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.

根据这些曲线，说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。

Inorganic bonding was suitable for assembly and fixing of small punch of rubber, plastic and stamping die.

氧化铜无机粘接适合于橡胶、塑料以及冷冲压模具小型芯小冲头的装配与固定。